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product struct ure silicon monolithic integrated circuit this product is not designed protection against radioactive rays. 1 / 30 tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 lcd segment drivers multi - function lcd segment drivers b u9150 1 kv - m max 2 04 segment( 5 1 seg x4com) general description the bu91501kv - m is 1/4 or 1/3 - duty general - purpose lcd d river that can be used for frequency display in electronic tu ners under the control of a microcontroller. the bu91501kv - m can drive up to 2 04 lcd segments directly and c ontrol up to 4 general - purpose output ports and up to 30 key input detection. features ? aec - q100 qualified (note) ? key input function for up to 30 k eys (a key scan is performed only when a key is pressed.) ? either 1/4 or 1/3 duty can be selected 1/4 duty drive up to 204 segments 1/3 duty drive up to 156 segments ? integrated ram for display data (ddram) ? segment/gpo (max 4port) output mode selectable ? su pport standby mode ? integrated power - on reset circuit ? integrated oscillator circuit ? no external component ? low power consumption design (note ) grade 2 applications ? car audio, home electrical appliance, meter e quipment etc. key specifications supply volta ge range: 2.7v to 6.0v lcd drive power supply range: 4.5v to 6.0v operating temperature range: - 40c to + 105c max segments: 204 segments display duty: 1/3, 1/4 selectable bias: 1/2, 1/3 selectable interface: 3wire serial interface package w (typ.) x d (typ.) x h (max.) typical application circuit fi gure 1 . typical application circuit vqfp64 12.00mm x 12.00mm x 1.60mm lcd panel ( up to 204 segments ) vdd vlcd resb csb scl sd do com1 com2 com3 p1/s1 p2/s2 p4/s4 s5 com4/s41 (p1) (p2) (p4) +5v +5.5v (note1) to control ler s40 from contro ller ks1/s42 | ks6/s47 ki1/s48 | k i5/s52 (general purpose ports ) (for use control of backlight) key matrix (note1) (note1) insert capaci tors between vdd/vlcd and vss c0.1uf . datashee t
2 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 block diagram / pin configuration / pin description figure 2. block diagram figur e 3. pin configuration (top view) terminal terminal no. i/o handling when unused functions csb 59 i vdd &klsvhohfw3/dfwlyh scl 60 i vss serial data transfer clock sd 61 i vss input serial data vdd 63 - - power supply for the logic osc 56 i/o ope n/vss external clock input: fix to low or open when the internal clock mode setting. do 58 o open output data resb 57 i vdd reset input: 5(6% 3/'lvsod\lvglvdeohg 5(6% 3+'lvsod\lvfrqwuroodeoh however, serial data can not be transferred when 5(6%lv3/ vss 64 - - power supply pin. must be connected to ground. vlcd 62 - - power supply for the lcd driver com1~com3 41 to 43 o open common output for lcd driver com4/s41 44 o open common / segment output for lcd driver. assigned as segment out put in 1/3duty mode. s1/p1~s4/p4 1 to 4 o open segment output for lcd driving / general purpose output s1/p1 ks5/s46 ks6/s47 ki1/s48 ki2/s49 ki3/s50 ki4/s51 ki5/s52 do ks1/s42 ks2/s43 ks3/s44 ks4/s45 ks6/ s47 ks5/s46 ks4/s45 ks3/s44 ks2/s43 ks1/s42 s40 s5 s4/p4 s2/p2 s1/p1 resb p.o.r shift register vlcd osc do sd scl csb vdd com1 com2 com3 com4/s41 control register segment driver & latch common driver clock generator lcd voltage gen erator 3 - spi interface + - + - key buffer key scan ki5/s52 ki4/s51 ki3/s50 ki2/s49 ki1/s48 s45 s44 s43 s42 com4/s41 com3 com2 com1 s40 s39 s38 s37 s36 s35 s34 s33 s46 s32 s47 s31 s48 s30 s49 s29 s50 s28 s51 s27 s52 s26 osc s25 resb s24 test s23 csb s22 scl s21 sd s20 vlcd s19 vdd s18 vss s17 49 32 33 16 48 1 64 17 p1/s1 p2/s2 p3/s3 p4/s4 s5 s6 s7 s8 s9 s10 s11 s12 s13 s14 s15 s16 16 1
3 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 absolute maximum ratings ( ta=25 c , vss=0.0v) parameters symbol ratings unit remarks power supply voltage 1 vdd - 0.5 to +7.0 v power supply po wer supply voltage 2 vlcd - 0.5 to +7.0 v lcd drive voltage power dissipation pd 1.0 0 (note2) w input voltage range vin - 0.5 to vdd+0.5 v operating temperature range topr - 40 to + 105 c storage temperature range tstg - 55 to +125 c (note2) when oper ated higher than ta=25c, subtract 10mw per degree. (using rohm standard board) (board size: 70mm70mm1.6mm material: fr4 board copper foil: land pattern only) caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can e ither be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. reco mmended operating conditions parameters symbol ratings unit remarks min typ max power supply voltage 1 vdd 2.7 - 6.0 v power supply power supply voltage 2 vlcd 4.5 - 6.0 v lcd driver voltage (note3) the power supply condition shall be met vlcd ? ? ivlcd2 - 65 140 vdd=vlcd=5.0v, output unloaded 1/3 bias, ffr=80hz
4 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 electrical characteri stics C ? ? tdc tdr do vlcd = 5.0v vlcd = 4.5v vlcd = 6.0v figure 5 . 3 - wire ser ial interface timing 60 70 80 90 100 -40 -20 0 20 40 60 80 100 temperature[ scl csb sd tcss tf tslw tscyc tshw tr tsds tsdh tcsh tchw
5 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 i/o equivalent circuit figure 6. i/o equivalent circuit function descriptions command and data transfer method 3 - spi (3 - wire se rial interface) this device is controlled by a 3 - wire signal (csb, scl, and sd). )luvw,qwhuidfhfrxqwhulvlqlwldol]hgzlwk&6% 3+ 6hwwlqj&6% /hqdeohv6'dqg6&/lqsxwv first, ,qwhuidfhfrxqwhulvlqlwldol]hgzlwk&6% 3+ dqgwkhq&6% /pdnhv6' and scl input enable. the protocol of 3 - spi transfer is shown as follows. each command starts with d7 bit as msb data iroorzhge\'wr'wklvlvzkloh&6% / (internal data is latched at the rising edge of scl, then the data is converted to an 8 - bit parallel data at the falling edge of the 8 th clk.) :khq\rxulvh&6% 3+lqfdvhfrppdqgohvvwkdqelwfrppdqgdqggdwdduhfdqfhohg (1) write mode figure 7. 3 - spi data transfer format
6 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 (2) read mode (key rd command only) the following occurs when key read by key rd command. if key rd command is recognized at the rising edge of 8th clk, it enters read mode after the falling edge of 8th clk and then key data is output through do. 6hwwlqj&6% +fdqh[lw5hdgprghdiwhurugxul ng serial data transfer. figure 8. serial data output format command transfer method $iwhu&6% +:/wkhvwe\whvkdooehdfrppdqg 3ohdvhuhihuwr3&rppdqg7deoh when set command except data write(datawr), the next byte will be (continuously) a command. when set datawr command, the following bytes will be display data bytes. comma nd command command command display data ? (datawr) once it becomes display data transfer mode, it will not be able to send command . ,i\rxvhqgfrppdqgdjdlqsohdvhulvh&6% + display data transfer method this lsi has display data ram (ddram ) of 514=204bit. the relationship between data input and display data, ddram data and address are as follows. command 00001010 d1 d2 d3 d4 d5 d6 d7 d8 d9 d10 d11 d12 d13 ?
7 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 1/3 duty mode ddram address/segment outputs 00h 01h 02h ... 27h 28h 29h ... 31h 32h 33h bit 0 d1 d4 d7 d118 d121 d124 d148 d151 d154 com1 1 d2 d5 d8 d119 d122 d125 d149 d152 d155 com2 2 d3 d6 d9 d120 d123 d126 d150 d153 d156 com3 s1 s2 s3 s40 s41 s42 s50 s51 s52 transferred data is written to the ddram by every 3bits 7khzulwhrshudwlrqlvfdqfhoohglilwfkdqjhv&6% /:+ before 3bits data transfer. 1/4 duty mode ddram address/ segment outputs 00h 01h 02h ... 27h 28h 29h ... 30h 31h 32h bit 0 d1 d5 d9 d157 d161 d165 d193 d197 d201 com1 1 d2 d6 d10 d158 d 162 d166 d194 d198 d202 com2 2 d3 d7 d11 d159 d163 d167 d195 d199 d203 com3 3 d4 d8 d12 d160 d164 d168 d196 d200 d204 com4 s1 s2 s3 s40 s42 s43 s50 s51 s52 transferred data is written to the ddram by every 4bits. the write operation is canc hoohglilwfkdqjhv&6% /:+ before 4bits data transfer. relationship between display data and segment output pins 1/3 duty mode output terminal com1 com2 com3 address output terminal com1 com2 com3 address s1/p1 d1 d2 d3 00 s27 d79 d80 d81 1a s2/p 2 d4 d5 d6 01 s28 d82 d83 d84 1b s3/p3 d7 d8 d9 02 s29 d85 d86 d87 1c s4/p4 d10 d11 d12 03 s30 d88 d89 d90 1d s5 d13 d14 d15 04 s31 d91 d92 d93 1e s6 d16 d17 d18 05 s32 d94 d95 d96 1f s7 d19 d20 d21 06 s33 d97 d98 d99 20 s8 d22 d23 d24 07 s34 d100 d101 d102 21 s9 d25 d26 d27 08 s35 d103 d104 d105 22 s10 d28 d29 d30 09 s36 d106 d107 d108 23 s11 d31 d32 d33 0a s37 d109 d110 d111 24 s12 d34 d35 d36 0b s38 d112 d113 d114 25 s13 d37 d38 d39 0c s39 d115 d116 d117 26 s14 d40 d41 d42 0d s40 d118 d119 d120 27 s15 d43 d44 d45 0e com4/s41 d121 d122 d123 28 s16 d46 d47 d48 0f ks1/s42 d124 d125 d126 29 s17 d49 d50 d51 10 ks2/s43 d127 d128 d129 2a s18 d52 d53 d54 11 ks3/s44 d130 d131 d132 2b s19 d55 d56 d57 12 ks4/s45 d133 d134 d135 2c s20 d58 d59 d60 13 ks5/s46 d136 d137 d138 2d s21 d61 d62 d63 14 ks6/s47 d139 d140 d141 2e s22 d64 d65 d66 15 ki1/s48 d142 d143 d144 2f s23 d67 d68 d69 16 ki2/s49 d145 d146 d147 30 s24 d70 d71 d72 17 ki3/s50 d148 d149 d150 31 s25 d73 d74 d75 18 k i4/s51 d151 d152 d153 32 s26 d76 d77 d78 19 ki5/s52 d154 d155 d156 33 (note5) in case of s1/p1~s4/p4, com4/s41, ks1/s42~ks6/s47 and ki1/s48~ki5/s52 are selected for segment output.
8 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 for example, s11 output case bits in a ddram segment output pin (s11) d 31 d32 d33 0 0 0 off - state of the lcd elements corresponding to com1, 2 and 3 0 0 1 on - state of the lcd element corresponding to com3 0 1 0 on - state of the lcd element corresponding to com2 0 1 1 on - state of the lcd elements corresponding to com2 and 3 1 0 0 on - state of the lcd element corresponding to com1 1 0 1 on - state of the lcd elements corresponding to com1 and 3 1 1 0 on - state of the lcd elements corresponding to com1 and 2 1 1 1 on - state of the lcd elements corresponding to com1, 2 and 3
9 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 1/4 duty output terminal com1 com2 com3 com4 address output terminal com1 com2 com3 com4 address s1/p1 d1 d2 d3 d4 00 s27 d105 d106 d107 d108 1a s2/p2 d5 d6 d7 d8 01 s28 d109 d110 d111 d112 1b s3/p3 d9 d10 d11 d12 02 s29 d113 d114 d115 d116 1c s4 /p4 d13 d14 d15 d16 03 s30 d117 d118 d119 d120 1d s5 d17 d18 d19 d20 04 s31 d121 d122 d123 d124 1e s6 d21 d22 d23 d24 05 s32 d125 d126 d127 d128 1f s7 d25 d26 d27 d28 06 s33 d129 d130 d131 d132 20 s8 d29 d30 d31 d32 07 s34 d133 d134 d135 d136 21 s9 d33 d34 d35 d36 08 s35 d137 d138 d139 d140 22 s10 d37 d38 d39 d40 09 s36 d141 d142 d143 d144 23 s11 d41 d42 d43 d44 0a s37 d145 d146 d147 d148 24 s12 d45 d46 d47 d48 0b s38 d149 d150 d151 d152 25 s13 d49 d50 d51 d52 0c s39 d153 d154 d155 d156 2 6 s14 d53 d54 d55 d56 0d s40 d157 d158 d159 d160 27 s15 d57 d58 d59 d60 0e ks1/s42 d161 d162 d163 d164 28 s16 d61 d62 d63 d64 0f ks2/s43 d165 d166 d167 d168 29 s17 d65 d66 d67 d68 10 ks3/s44 d169 d170 d171 d172 2a s18 d69 d70 d71 d72 11 ks4/s45 d 173 d174 d175 d176 2b s19 d73 d74 d75 d76 12 ks5/s46 d177 d178 d179 d180 2c s20 d77 d78 d79 d80 13 ks6/s47 d181 d182 d183 d184 2d s21 d81 d82 d83 d84 14 ki1/s48 d185 d186 d187 d188 2e s22 d85 d86 d87 d88 15 ki2/s49 d189 d190 d191 d192 2f s23 d89 d 90 d91 d92 16 ki3/s50 d193 d194 d195 d196 30 s24 d93 d94 d95 d96 17 ki4/s51 d197 d198 d199 d200 31 s25 d97 d98 d99 d100 18 ki5/s52 d201 d202 d203 d204 32 s26 d101 d102 d103 d104 19 (note6) in case of s1/p1~s4/p4, ks1/s42~ks6/s47 and ki1/s48~k i5/s52 are selected for segment output. for example, s11 output case bits in the ddram segment output pin (s11) d41 d42 d43 d44 0 0 0 0 off - state of the lcd elements corresponding to com1,2 ,3 and4 0 0 0 1 on - state of the lcd element corresponding to com4 0 0 1 0 on - state of the lcd element corresponding to com3 0 0 1 1 on - state of the lcd elements corresponding to com3 and 4 0 1 0 0 on - state of the lcd element corresponding to com2 0 1 0 1 on - state of the lcd elements corresponding to com2 and 4 0 1 1 0 on - state of the lcd elements corresponding to com2 and 3 0 1 1 1 on - state of the lcd elements corresponding to com2,3 and 4 1 0 0 0 on - state of the lcd element corresponding to com1 1 0 0 1 on - state of the lcd elements corresponding to com1 and 4 1 0 1 0 on - state of the lcd elements corresponding to com1 and 3 1 0 1 1 on - state of the lcd elements corresponding to com1, 3 and 4 1 1 0 0 on - state of the lcd elements corresponding to com1 and 2 1 1 0 1 on - state of the lcd elements corresponding t o com1,2 and 4 1 1 1 0 on - state of the lcd elements corresponding to com1,2 and 3 1 1 1 1 on - state of the lcd elements corresponding to com1,2 3 and 4
10 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 serial data output figure 9. serial data output kd1 to kd30: key data sa: sl eep acknowledge data key data read command (key rd): 1000_0101 (note7) if a key data operation is executed when do is high, the read key data (kd1 to kd30) and sleep acknowledge data(sa) w ill be invalid. output data kd1 to kd30: key data when a key m atrix of up to 30 keys is formed from the ks1 to ks6 output pins and the ki1 to ki5 input pins and one of those keys is pressed, the key output data corresponding to that key will be set to 1. the table shows the relationship between those pins and the key data bits. ki1 ki2 ki3 ki4 ki5 ks1 kd1 kd2 kd3 kd4 kd5 ks2 kd6 kd7 kd8 kd9 kd10 ks3 kd11 kd12 kd13 kd14 kd15 ks4 kd16 kd17 kd18 kd19 kd20 ks5 kd21 kd22 kd23 kd24 kd25 ks6 kd26 kd27 kd28 kd29 kd30 sa: sleep acknowledge data this output data is used to set the state when the key is pressed. in this case, do will go to the low level. if serial data is input during this period and the mode is set (normal mode or sleep mode), the ic will be set to that mode. sa is set to 0 in the sleep mode and to 1 in the normal mode.
11 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 key scan operation key scan timing the key scan period is 288t(s). to reliably determine the on/off state of the keys, the bu91501kv - m scans the keys twice and determines that a key has been pressed when the key data agrees. it out puts a key data read request (a low level on do) 61 0 t(s) after starting a key scan. if the key data does not agree and a key is pressed at that point, it scans the keys again. thus, bu91501kv - m cannot det ect a key press shorter than 610 t(s). figure 10. key scan timing normal mode ks1/s42 - ks6/s47 pins are set high. when a key is pressed, a key scan is started and the keys are scanned until all keys are released. multiple key presses are recognized by determining whether m ultiple key data bits are set. if a ke y is pressed for longer than 610 t(s) (where t=1/fosc (when external clock input, fosc is a quarter of external clock) ), the bu91501kv - m outputs a key data read request (a low level on do) to the controller. the contro ller acknowledges this request and reads the key data. however, if csb is / during a serial data transfer, do will be set high. after the controller reads the key data, the key data read request is cleared (do is set high) and bu91501kv - m performs anoth er key scan. also note that do can be controlled to be an open - drain outp ut or a cmos output. if set to be an open - drain output, a pull - xsuhvlvwruehwzhhqdqg.?lvuhtxluhg figure 11. key scan operation in normal mode 576 t[s] ks1 ks2 ks3 ks4 ks5 ks6 9216t[s] 1 2 3 4 5 6 1 2 3 4 5 6 * * * * * * * * * * t= 1 fosc 610t[s] sd do key input 1 key input 2 key scan csb 610t[s] 610t[s] key data read request key data read key data read key data read request key rd command (85h) key rd command (85h) key data read request key data read key rd command (85h) serial data transfer serial data transfer serial data transfer external clock input ? ? ? ? ? ? ? ? ? 4 / 1 fosc t ? ? ? ? ? ? ? ? ? fosc t 1
12 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 sleep mode ks1/s42 - ks6/s47 pins are set high or low by slp ctrl p3,p2 data. (refer to the slp ctrl description). if a key on one of the lines corresponding to a ks1 to ks6 pin which is set high is pressed, the oscillator on the osc pin is started and a key scan is performed. keys are scanned until all keys are released. multiple key presses are recognized by determining whether multiple key data bits are set. if a key is pressed for longer than 610t (s)(where t=1/fosc (when external clock input, fosc is a quarter of external clock) ) the bu91501kv - m outputs a key data read request (a low level on do) to the controller. the controller acknowledges this request and reads the key data. however, if csb is / during a serial data transfer, do will be set high. after the controller reads the key data, the key data read request is cleared (do is set high) and the bu91501kv - m performs another key scan. however, this does not clear sleep mode. also note that do can be controlled to be an open - drain output or a cmos output. during open - drain output selection, do is an open - drain output so a pull - up uhvlvwruehwzhhq.?dqg.?lvuhtxluhg sleep mode key scan example example: when slp ctrl p3= [0], p2= [1] (sleep with only ks6 high) (note8) these diodes are required to reliably recognize multiple key presses on t he ks6 line when sleep mode state with only ks6 high, as in the above example. that is, these diodes prevent incorrect operations due to sneak currents in the ks6 key scan output signal whe n keys on the ks1 to ks5 lines are pressed at the same time. figure 12. key scan operation in sleep mode key input 1 do key scan sd csb 610t[s] 610t[s] key rd command (85h) key rd command (85h) serial data transfer serial data transfer serial data transfer key data read key data read key data read request key data read request external clock input ? ? ? ? ? ? ? ? ? 4 / 1 fosc t ? ? ? ? ? ? ? ? ? fosc t 1
13 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 multiple key presses although the bu91501kv - m is capable of key scanning without inserting diodes for dual key presses, triple key presses on the ki1 to ki5 input pin lines, or multiple key presses on the ks1 to ks6 output pin lines, multiple presses other than these cases may result in keys that were not pressed recognized as having been pressed. therefore, a diode must be inserted in series with each key. applications that do not recognize multiple key presses of three or more keys should check the key data for three or more 1 bit and ignore such data. oscillator several kinds of clock for logic and analog circuits are generated from internal oscillation circuit or external clock. the osc pins are open or connected to vss if the internal oscillator is used. (note9) to use external clock mode, please set in drv ctrl1 command. figure 13. internal clock mode figure 14. external clock mode osc bu9 1 501kv - m vss osc bu9 1 501kv - m clock input open o r vss short
14 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 lcd driver bias/duty circuit this lsi generates lcd driving voltage with on - chip buffer amp. and it can drive lcd at low power consumption. * 1/3 or 1/2bias and line or frame inversion mode can be selected by drv ctrl2. * 1/4 or 1/3duty can be selected by drv ctrl1 command. refer t r3/&'zdyhirupderxwhdfk/&'zdyhirup lcd waveform 1/4duty, 1/3bias line inversion frame inversion frame inversion figure 15. lcd waveform in line inversion figure 16. lcd waveform in frame inversion
15 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 1/4duty, 1/2bias line invers ion frame inversion figure 17. lcd waveform in line inversion figure 18. lcd waveform in frame inversion
16 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 1/3duty, 1/3bias line inversion frame inversion figure 19. lcd waveform in line inversion figure 20. lcd waveform in frame inversion
17 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 1/3duty, 1/2bias line inversion frame inversion figure 21. lcd waveform in line inversion figure 22. lcd waveform in frame inversion
18 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 command table command. bin descriptions d7 d6 d5 d4 d3 d2 d1 d0 slp ctrl 1 0 0 1 p3 p2 * * sleep control seg ctrl 1 0 1 1 p3 p2 p1 * segment control drv ctrl1 1 1 0 0 p3 p2 p1 0 drive control1 >& duty set, osc control >' drv ctrl2 1 1 0 1 0 p2 p1 0 drive control2 >& bias set, inversion mode >' drv ctrl3 1 0 1 0 p3 p2 * p0 drive control3 >& keyscan output set, do set >' key rd 1 0 0 0 0 1 0 1 key data read swrst 1 1 1 1 0 0 0 1 software reset disctrl 1 1 1 1 1 0 p1 * display control >& display on/off >' adset 0 1 p5 p4 p3 p2 p1 p0 address set data wr 0 0 0 0 1 0 1 0 data write 'rq?wfduh
19 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 detailed command description sleep control (slp ctrl) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 0 0 1 p3 p2 * * 'rq?wfduh p3, p2: normal mode/sleep mode switching control data these control data bits select key scan output pins ks1 to ks6 states of during key scan standby. control bits mode internal osc segment outputs /common outputs output pin states during key scan standby reset conditions p3 p2 ks1 ks2 ks3 ks4 ks5 ks6 0 0 normal enabled operating h h h h h h 0 1 sleep disabled low(vss) l l l l l h | 1 0 sleep l l l l h h 1 1 sleep h h h h h h >& note10 >' when drv ctrl3 >& p3, p2 >' = >& 1, 1 >' , ks1 to ks6 outputs are selected as segment outputs. segment control (seg ctrl ) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 0 1 1 p3 p2 p1 * 'rq?wfduh p3 to p1 : segment o utput / general purpose output switching control data these control bits select the function of the s1/p1 to s4/p4 output pins. (segment output pins or general purpose output pins). control bits status of the pins reset conditions p3 p2 p1 s1/p1 s2/p2 s3/p3 s4/p4 0 0 0 s1 s2 s3 s4 | 0 0 1 p1 s2 s3 s4 0 1 0 p1 p2 s3 s4 0 1 1 p1 p2 p3 s4 1 0 0 p1 p2 p3 p4 (note11) sn(n=1 to 4) : assigned as a segment output pin pn(n=1 to 4) : assigned as a general purpose output pin relationship of bit assignment between general purpose output pin and bit in ddram output pin corresponding bit in ddram 1/3 duty 1/4 duty s1/p1 d1 d1 s2/p2 d4 d5 s3/p3 d7 d9 s4/p4 d10 d13 in case of 1/4 duty mode and s4/p4 is configured as a general purpose output pins. s4/p4 is set to high (vlcd leve oli'lvvhwwr3lq''5$0 63lvfohduhgwr/2:966ohyholi'lvvhwwr3lq''5$0
20 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 drive control1 (drv ctrl1) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 1 0 0 p3 p2 p1 0 p3: 1/3 duty drive or 1/4 duty drive switching control data th is control data bit selects either 1/3 duty drive or 1/4 duty drive. p3 duty mode status of (com4/ s41) reset conditions 0 1/4 com4 | 1 1/3 s41 (note12) com4: common output s41: segment output p2,p1 : frame frequency s witching control data these control data bits select frame frequency setting. setting p2 p1 reset conditions 80hz 0 0 | 100hz 0 1 120hz 1 0 external clock input 1 1 relationships between frame frequency (ffr) and divide number p2 p1 divide number ffr [hz] 1/3 duty 1/4 duty 1/3 duty 1/4 duty 0 0 510 512 80 80 0 1 408 408 100 100 1 0 342 344 120 120 1 1 2040 2048 - - formula to calculate frame frequency from frequency and divide number: 3)udphiuhtxhqf\ iuhtxhqf\'lylghqxpehu ex) in case, 1/4 duty mode, (p2,p1) = (0,0) f fr = 40.96[khz] / 512 = 80[hz] (note13) built - in oscillator circuit frequency = 40.96 khz (typ). drive control2 (drv ctrl2) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 1 0 1 0 p2 p1 0 p2: 1/3 bias drive or 1/2 bias drive switching control data this control data bit selects either 1/3 bias drive or 1/2 bias drive. p2 bias mode reset conditions 0 1/2 1 1/3 | p1: line inversion or frame inversion switching control data this cont rol data bit selects either line inversion drive or frame inversion drive. p1 inversion mode reset conditions 0 line | 1 frame
21 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 drive control3 (drv ctrl3) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 0 1 0 p3 p2 * p0 'rq?wfduh p3 to p2: key scan output port/segment output port switching control data these control data bits select key scan outputs or segment outputs. when (p3,p2)=(1,1), keyscan doesn't function. key scan pins are all segment outputs. thus, maximum segment display number and ram last address change based on this value. control bits status of pins maximum segment display number last addres s p3 p2 ks1/ s42 ks2/ s43 ks3/ s44 ks4/ s45 ks5/ s46 ks6/ s47 1/3 duty 1/4 duty 1/3 duty 1/4 duty 0 0 ks1 ks2 ks3 ks4 ks5 ks6 123 160 28h 27h 0 1 s42 ks2 ks3 ks4 ks5 ks6 126 164 29h 28h 1 0 s42 s43 ks3 ks4 ks5 ks6 129 168 2ah 29h 1 1 s42 s43 s44 s45 s 46 s47 156 204 33h 32h p0: output setting for do this control data bit selects either open drain output or cmos output. p0 setting reset conditions 0 open drain output | 1 cmos output 3xooxsuhvlvwrun - n lvuhtxluhgzkhqvhohfwlqj2shq'udlq2xwsxwvhwwlqjiru'2 be careful the pull up voltage not to be higher than vdd voltage. key data read (key rd) msb lsb d 7 d6 d5 d4 d3 d2 d1 d0 1 0 0 0 0 1 0 1 display control (disctrl) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 1 1 1 1 0 p1 * 'rq?wfduh p1: segment on/off control data this control data bit controls the on/off state of the segments. p1 display status reset conditions 1 on 0 off | control bits output pin state maximum number of input keys reset conditions p3 p2 ks1/ s42 ks 2/ s43 ks3/ s44 ks4/ s45 ks5/ s46 ks6/ s47 0 0 ks1 ks2 ks3 ks4 ks5 ks6 30 0 1 s42 ks2 ks3 ks4 ks5 ks6 25 1 0 s42 s43 ks3 ks4 ks5 ks6 20 1 1 s42 s43 s44 s45 s46 s47 0 |
22 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 software reset (swrst) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 1 1 1 0 0 0 1 this is the software reset command. after sending this command, each register, ddram data and ddram address are initialized. addre ss set (adset) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 0 1 p5 p4 p3 p2 p1 p0 address which could be set starts from 00(hex) until ram last address. setting of values other than the above is not allowed. (otherwise, ad dress is set to 0.) refer to 3 display data transfer method for ram last address . data write (datawr) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 0 0 0 0 1 0 1 0 data transfer can be started by this command. set the csb pin to high to terminate the data transfer. 5hihuwr3&rppdqgdqg'dwd7udqvihu0hwkrg
23 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 initialize sequence recommended sequence after power - on to set this device to initial condition. software reset sequence hardware reset sequence power on power on ; ; csb +? ?,qlwldol]hg,) 5(6% /? ; ; csb /? ?6wduwwudqvihuulqj,)'dwd 5(6% +? ; ; swrst (execute software reset) csb +? ?,qlwldol]hg,) ; ; disctrl (display off) csb /? ?6wduwwudqvihuulqj,)'dwd ; ; set each command swrst (execute software reset) ; ; data wr disctrl (display off) ; ; csb +? 6hwhdfk&rppdqg ; ; csb /? '$7$:5 ; ; slp ctrl csb +? ; ; disctrl (display on) csb /? ; ; start display slp ctrl ; disctrl (display on) ; start display (note14) each register value, ddram addre ss and ddram data are random condition after power on till initialize sequence is executed. (note15) each register value, ddram address are reset by a hardware reset operation.
24 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 t1 t2 10% 10 % vdd min vdd min cautions in power - on sequence power - on reset (por) circuit this ls ,kdv33253rzhu - on reset) circuit and software reset function. when the power is on, ic internal circuit and reset pass through unstable low - voltage region. internal ic is not totally reset because vdd rises and this may result to malfunction. thus, por circuit and function of software reset are installed in order to prevent this. please follow the following recommended power - on sequences to allow the reset action to complete. set the power up conditions to meet the recommended tr, tf, toff, and vbo t spec below in order to ensure p.o.r operation. tr, tf, toff, vbot recommended conditions tr tf toff vbot less than 5ms less than 5ms more than 150ms less than 0.1v figure 23. power on/off waveform if it is difficult to meet above condition s, execute the following sequence after power - on. (1) set csb to high (2) clear csb to low and then issue a swrst command. figure 24. swrst command sequence power up sequence and power down sequence to prevent incorrect di splay, malfunction and abnormal current, vdd must be turn ed on before vlcd i n power up sequence . vdd must be turned off after vlcd in power do wn sequence . please satisfies 9/&'?9'' , t1>0ns, t2 >0ns figure 25. power on/off s equence vdd t f t r t off vbot vdd csb min 1ms min 50ns swrs t command vlcd vdd
25 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 display ddram data example if lcd layout pattern is shown as in figure 2 6 and 2 7 and ddram data is shown as in table2 , display pattern will be shown as in figure 2 8 . figure 26. example com line pattern figure 27. example of seg line pattern figure 28. example of display pattern s 1 s 2 s 3 s 4 s 5 s 6 s 7 s 8 s 9 s 10 s 11 s 12 s 13 s 14 s 15 s 16 s 17 s 18 s 19 s 20 com1 d0 1 1 0 1 1 1 1 0 1 1 0 0 0 0 0 0 0 0 0 0 com2 d1 0 1 1 1 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 com3 d2 0 0 1 0 1 0 0 1 1 1 0 0 0 0 0 0 0 0 0 0 com4 d3 0 1 1 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0ah 0bh 0ch 0dh 0eh 0fh 10h 11h 12h 13h table 2. ddram data map com1 com2 com3 com4 s1 s3 s2 s4 s5 s6 s8 s7
26 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 operational notes 1. rever se c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supp ly pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of t he application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in t his specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these c onditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling c apacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards w hen testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may vxemhfwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?vsrzhuvxsso\ should always be turned off com pletely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting error s ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
27 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 operational notes C
28 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 ordering information b u 9 1 5 0 1 k v - m e 2 part number package packaging and forming specification m: for automotive e2: embossed tape and reel (vqfp64) kv : vqfp64 marking diagram vqfp64 (top view) b u 9 1 5 0 1 k v part number marking lot number 1pin mark
29 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 physical dimension, tape and reel information package name vqfp64
30 / 30 bu 9 1 50 1 kv - m data s heet tsz02201 - 0p4p0d301120 - 1 - 2 8.july.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 1 5 >? 001 revision history version d ate d escription 00 1 8 . july .201 5 new edition
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bu91501kv-m package vqfp64 unit quantity 1000 minimum package quantity 1000 packing type taping constitution materials list inquiry rohs yes bu91501kv-m - web page distribution inventory

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